Electronics Forum | Tue Apr 21 02:28:54 EDT 2015 | dinhhuunam
Juki GL-1.... Any thoughts? I'm New to the > industry and I'm trying to buy a new screen > printer. I have two in mind, DEK and Juki. Hi Sir, I'll advise you the SJ INNOTECH Vision Screen printer Best Solution & Service for You Model HP-520S Hi
Electronics Forum | Thu Sep 15 21:25:43 EDT 2011 | darby
G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say the pin width is 0.2mm and the pad design ha
Electronics Forum | Thu Sep 15 21:36:52 EDT 2011 | darby
I also posted this in the design section... G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F
Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
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