Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
Electronics Forum | Tue Sep 21 08:49:59 EDT 1999 | Chad Notebaert
| | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | thanks | | | We use 6 mil lasercut stencils with 15% redu
Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
Electronics Forum | Mon Feb 16 14:18:30 EST 2009 | jorge_quijano
1000 0402's, Micro BGA, QFP 0.4mm pitch, TSOP), we are trying to know what kind of equipment do you recommend to use in our factory, we already have Screen Printer, Chip shooters, Reflow oven, AOI, Stencil cleaner (manual), X ray, ICT... what else do
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies
| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w
Electronics Forum | Thu Jun 14 13:12:53 EDT 2012 | scottp
I haven't been in a bad enough situation to try it yet, but I had a conversation with Alpha Metals when we started doing 0.4 mm pitch and they mentioned that if we got into a situation like yours we could send them a board and they'd modify the artwo
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