Electronics Forum | Fri Jun 02 16:30:42 EDT 2000 | Michael Parker
I found a reference to Cost of Conversion earlier this year. Basically, the average cost to convert a single component from raw materials to assembled goods is $.08, just after pick and place. After placement and before reflow, repair (solder paste r
Electronics Forum | Fri May 04 11:42:48 EDT 2012 | scottjwarren
Greetings! I run a small CM company in the Midwest. We built our business on THT production for the boutique music products industry and are currently planning our launch of a low-volume/high-mix SMT line to support the growth of our business. Our
Electronics Forum | Sun Jul 28 16:11:40 EDT 2013 | jfs
Greetings! I run a small CM company in the > Midwest. We built our business on THT production > for the boutique music products industry and are > currently planning our launch of a > low-volume/high-mix SMT line to support the > growth of our
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon May 02 12:35:33 EDT 2016 | adamjs
Or try : http://www.sipad.com/ I think sipad is incredibly cool and would be the perfect solution, but is way too expensive. We're paying $0.80/each for four-layer ENIG boards, 50cm^2 with 0.125mm trace/space and 0.8mm-pitch LGA landings in lots of
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
