Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Thu Jun 06 21:35:22 EDT 2002 | ianchan
Hi mates, 1) Firstly, thanks for everyone's reply to this thread. Cheers! 2) Secondly, Hussman69: sure u dun mean that blokes' tie was too tight? musta cut off his blood flow and oxygen?!? 3) Thirdly, we checked with our paste supplier, and they r
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2012-09-10 12:48:23.0
To help companies gain the most out of HDI technology, Raytheon is sponsoring the “IPC HDI Conference: Advancements in Materials, Processes and Applications,” October 24–25 in Los Angeles, Calif.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
| https://www.eptac.com/wp-content/uploads/2013/06/eptac_06_19_13.pdf
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. Thus, both sides of the boards can be easily utilized for mounting, and there is no need for plated drill holes. For the purpose of connecting traces in the circuit layers, one may use vias instead, which are structurally the same as plated through-holes but much smaller
