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Siemens 6DS1223-8AB

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Design rule for vias

Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef

It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w

Shielding from Nearby Heat-Any Tricks

Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet

Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening

changing from no-clean to clean

Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef

Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.

Re: Micro Vias in Pads

Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen

| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl

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