Parts & Supplies | Assembly Accessories
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Parts & Supplies | Pick and Place/Feeders
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Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish
Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Wed Aug 24 09:52:26 EDT 2005 | javi
Patric, The product is exempted from the RoHS regulativ 1'st phase(2010) and our policy is to follow the new EU regulations as this will also push the Industri technolegy and the SMT process. Our concern is more that we are not able to qualify the p
