Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Fri Apr 18 11:05:47 EDT 2014 | horchak
First things first. Check the manufactures specs on the electrolytic caps as they may not be able to handle the lead free temps.
Electronics Forum | Thu Apr 17 17:57:13 EDT 2014 | proy
Hello We use a 5 zone conceptronics HVN70 and never before have we had something we could not do including 6 layers Rohs complicated boards. Recently we had a larger - simple 2 layer board - all 1206's etc however there are 15 pcs of a LARGE high m
Electronics Forum | Fri Jan 12 12:35:58 EST 2007 | realchunks
Several things to check. Are you reflowing towards higher temps for the no-lead parts? If so are you using a 63/37 paste? If so you are buring your flux off too early. Get a solder paste designed for lead free parts on a leaded baord. There are
Electronics Forum | Sat Jan 15 10:45:04 EST 2005 | Brad
HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.
Electronics Forum | Thu Nov 11 08:58:27 EST 2004 | russ
Component body temp is what you are specifying.
Electronics Forum | Mon Jan 17 11:23:49 EST 2005 | Brad
Ya Russ is right for Ti Parts they tend to use more pelladium, which requires a bit more heat average temp increase is about 10 degrees C. from 225-235. As far as optimum solder joint I look for fillets on all sides of leads. The back of the lead is
Electronics Forum | Tue Sep 28 08:23:23 EDT 2004 | patrickbruneel
The lead free debates are getting more and more interesting Didn't know that low labor cost was also lowering melting temps of LF alloys
