Electronics Forum | Tue Sep 28 08:23:23 EDT 2004 | patrickbruneel
The lead free debates are getting more and more interesting Didn't know that low labor cost was also lowering melting temps of LF alloys
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Fri Oct 31 13:06:42 EST 2003 | Kris
Hi, What would also be important is the time above 217. 20 secs above 225 may be the same as 45 secs above 218 That 7 degres might just buy you enough to sweep the non lead free components through Has anyone tried 220 or 218 peak temp but at lo
Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds
MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
Electronics Forum | Mon Sep 27 11:30:05 EDT 2004 | grayman
Your problem is easy. Lead free solder is like 63/37 solder paste when it was started. We make things complicated. We believed before that lead free has high melting temp and will not produce good fellet so on.... The only thing you must do is to lo
Electronics Forum | Wed May 24 16:47:21 EDT 2006 | patrickbruneel
Inds, It's about time that lead-free components can stand higher temps "myth" stops. The only difference is the plating, the component itself has not changed. Can you give us an update on this threat? If you�re the same inds http://www.smtnet.com//
Electronics Forum | Sun Dec 26 21:18:04 EST 2004 | tellinghuisen
Chris, We also do not allow the use of Lead-Free BGAs in a lead based process. It is actually one of the things that scares us most about converting to Pb-free. Most of the suppliers that we have talked with are planning on moving to the SAC
Electronics Forum | Thu Sep 23 16:23:08 EDT 2004 | russ
Pb free pastes do not wet out like 63/37. Their are no claims from any manufacturers that I am aware of that say it will. Your "little solder balls" are likely caused from oxidization during reflow. What type paste are you using 3,4,5? What are t
Electronics Forum | Thu Jun 05 16:44:19 EDT 2003 | blnorman
The data we have is from an IBM report. Below 100�C the SAC reliability is almost double that of SnPb (-40 to 100�C thermal cycle). When the upper end temp is increased to 125�C the reliability drops to 75% of SnPb. I'd like to see the data that s
