Electronics Forum | Mon May 07 13:01:36 EDT 2007 | patrickbruneel
Jerry, In your initial post you give 260C as solder pot temp if you�re not using lead-free I would reduce the temp to 250C this will also reduce oxidation rate.
Electronics Forum | Thu Jun 19 12:48:32 EDT 2008 | mumtaz
What the hell our you talking about 200 c max? I would think any nolead part is capable of going hi-er that this. I think you are looking at max temps or something that does not make sents for temps you need to reflow.
Electronics Forum | Thu Jul 01 00:03:31 EDT 2010 | saukat
Hi.. I am optimizing the reflow oven temperature setting, Interested to know the ideal incoming chiller water temp. My machine is running lead-free process with the incoming chiller water at 12 degree C. Regards,
Electronics Forum | Wed Nov 30 11:43:15 EST 2005 | russ
You will be fine as long as you don't run BGAs this way. I would imagine that you have already been doing this for some time already. You might need to increase peak temp and or time with some of the lead finishes.
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Fri Feb 23 15:14:51 EST 2007 | James
I have this board that we are currently having problems with. When we run the BGA side with the hotter temp. the connectors on the other side lift off their pads. The BGA is lead free, that is why we have to use the hotter profile. Would it be
Electronics Forum | Tue Aug 22 18:15:50 EDT 2006 | russ
okay so both the 2005 formulas from interflux are clear alchol based fluxes. Yellow res huh? In looking at the temps here, I would say you might be too hot at both preheat and solder temp. You may be burning flux. How long is dwell time over wave
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
Electronics Forum | Thu Aug 07 16:52:49 EDT 2003 | craigj
We've been doing it for quite a while on some parts but are noticing that as more manufacturers are going lead free we are starting to see some issues. Particularily with pure tin on nickel. Have found that need to increase oven reflow temp and time
