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Reflow soldering of lead-free components with leaded solder paste

Electronics Forum | Fri Feb 23 14:50:14 EST 2024 | carl_p

That link doesn't work for me. From the more you explain - it does sound like an issue I've had in the past on a few different builds. In the end we traced it to a fault with the paste (they were having mixing issues in the chemistry) but they as y

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe

Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.

Super low volume board wash. Will this work?

Electronics Forum | Fri May 15 13:17:18 EDT 2009 | tomsmiley

We implemented an inexpensive home dishwasher solution last year for cleaning assemblies. It works very well for both lead free and tin/lead cleaning. DI water at room temp is all we do and the boards come out squeaky clean. We had to use the least

Germanium doping of SN100

Electronics Forum | Fri Dec 21 13:51:16 EST 2007 | howard stevens

Gentlemen, This is an interesting topic. If one refers to the Nihon Superior patent, they make the following claims. "Germanium makes the crystal finer when the alloy solidifies. Germanium appears on a grain boundary, preventing the crystal from b

Your opinion about RoHS and WEEE ?

Electronics Forum | Thu Dec 16 14:51:15 EST 2004 | blnorman

It's driven by those highly technically astute politicians in Europe. IPC has a lead-free forum you can subscribe to and almost to a person in the forum agrees that elimination of lead in solder is assinine. From the automotive end of electronics

Lead Free BGA's on non-RoHS Assembly

Electronics Forum | Mon Jan 29 10:41:30 EST 2007 | aj

Rob, We have ran LF BGA's with Lead Paste in the past. We actually got a MicroSection Analysis carried out and a full report which approved the Process. We had peak Temp around 225oC- 230oC . Its a matter of running the Lead Process at its max and

Voids in every Lead-free BGA solder Joint

Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben

I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th

delamination test

Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House

Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 19:22:54 EDT 2004 | russ

So if I get this right, your customer wants you to run this product as pb free even though it is not. In order to run this as pb free you need to run pb free paste. If you use 63/37 paste at the higher temps I believe that in addition to the compon

Lead Free Alloy

Electronics Forum | Wed Nov 07 12:29:41 EST 2007 | oswaldorey

Although greatly publicized and many papers on the subject, I wish to hear experiences from the field from professionals who have migrated from SnPb wave soldering to PbFree wave soldering. I am being pushed by one of my largest clients, an internati


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