Electronics Forum | Thu Mar 30 08:38:58 EST 2006 | Dan
We have this panel that is Gold Flash. Am I correct in assuming this is technically a lead-free panel then? We are running a WS paste, and the QFN28 has balls of solder instead of a fillet. My Max temp is 216, and the TAL was between 52-57 secs with
Electronics Forum | Fri Jul 23 04:27:59 EDT 2004 | greg york
Many trials conducted so far from single sided to Mixed technology dual wave with our LFB227/S 0.3Ag silver Lead free. Results are excellent, some say better than 63/37. One continueing problem though is the age old area of undercured resist and runn
Electronics Forum | Mon May 22 16:58:37 EDT 2006 | flipit
The best small reflow oven that I have ever used is the Sikama brand. Unfortunately they are not inexpensive and you will pay almost as much as you would for a full size reflow oven. Interestingly this is the oven I qualified for lead free and othe
Electronics Forum | Tue Aug 22 13:05:32 EDT 2006 | Board House
Hi CP, From a PCB manufacturing side, all of our product is Lead free / RoHs compliant if it has a surface finish other than Hot Air. To be ROHS compliant and Able to with stand Lead Free Assembly, this is where the board house would need to switch
Electronics Forum | Tue Jan 31 14:35:55 EST 2012 | hegemon
1. (NCMR) Non Conforming material report to your customer if you have signed up for a lead free job. Send everything back and tell him to replace the entire lot with correct material. or 2. Request a Change order from your customer, changing the
Electronics Forum | Thu Feb 10 16:45:36 EST 2005 | pjc
It all depends on what type of board you need to solder. If your boards are small in size and low thermal mass and your conveyor speed requirments are normal, then I'd say the OmniFlo 7 will do the job. It has a max zone temp setting of 280C. The cur
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
Electronics Forum | Thu Mar 09 16:14:19 EST 2006 | marc
CGO Assuming your system is performing well here are a few ideas to help out your profile.... - Pull the material spec and ensure you are meeting the requirements for times and temp. Many times the material will allow a mild soak of the board prior
Electronics Forum | Wed Jun 22 02:30:33 EDT 2011 | boardhouse
if its a RoHs Assembly they should be using an FR4 material designed with higher TD to handle higher Assembly temps. 370HR,IT158, IT180, 4000-29 just to name a few that would be suitable. Standard FR4 material is not designed to handle the higher as
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