Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
Electronics Forum | Mon Mar 04 17:47:44 EST 2019 | slthomas
The lowest peak temp. I've had the pleasure of working with is 240°C +/- 5°C. I can't imagine a manufacturer going much below that and still saying it's lead-free compatible. It would be interesting to know just how much TAL plays into the affect
Electronics Forum | Tue Oct 06 15:01:33 EDT 2020 | charliedci
We've used glass (pyrex, corningware) bread pans in the past, not filling them much over 1" deep. It takes a while but leaves solder ingots sized well to drop back in. Have not tried lead free yet, the higher temp could be an issue using same ty
Electronics Forum | Fri Oct 27 14:54:29 EDT 2023 | proceng1
I won't answer your design question, as I don't do PCB design. I will say that if your product is to ROHS, make sure that the connector you choose can handle the REFLOW temperatures required. As a CM, we have had some products that were intended fo
Electronics Forum | Mon Mar 26 06:10:54 EDT 2007 | RH
Dennis: Have you considered Asahi as a solder ball source? Asahi Technologies has helped produce over 90 million Lead Free PWB assemblies worldwide and has extensive experience in Lead Free solder processes at Sony, Hitachi, and Thompson. Solutions
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Fri Jan 28 09:03:43 EST 2011 | ldavis
Shannon, We have been using VP for all of our lead free production since 2007. Here are the items I can think of off the top of my head. Pro's - small footprint, minimal profiling needed once machine is understood, oxygen free soldering process, s
Electronics Forum | Mon Apr 12 09:36:57 EDT 2004 | wgaffubar
Russ, These are the pb free components that you mentioned that are coming around the bend. Not the old CBGA's. I use to use CBGA's alot with former company. These are 15 x 15 mm plastic BGA's with 14 mil pg free solder balls going on 8 mil gold pads.
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Mon Apr 25 12:19:21 EDT 2005 | siverts
Hi all, We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron. The components was just small RoHS SOIC's
