Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
Electronics Forum | Fri Feb 18 18:01:51 EST 2005 | Grant
Hi, Using good profiling makes all the difference. Its not easy, and thats where good software helps make it easy. If it's easy, then you tend to do it often, so things stay good. I like using this KIC software so much I wanted to take the profiler
Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Tue Apr 15 15:10:28 EDT 2008 | markhoch
We currently are using an older Electrovert Convection 7-Zone reflow oven for our Lead-Free assemblies. It has a maximum per zone Temperature setting of 280 Degrees C. This is causing an issue with one particular customer who has a fairly dense produ
Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp
Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n
Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1
Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Sun Jan 06 22:36:08 EST 2008 | mac88
My recommendation is that you send all your question to Mumtaz Y. Bora, Sr. Staff Component Engineer from Kyocera Wireless (mbora@kyocera-wireless.com). She is also a member of the committee that is writing the new specifications for Moisture Sensit
Electronics Forum | Fri Feb 23 09:55:02 EST 2024 | carl_p
Got you. 225C for peak does seem low to me. Henkle is the main one i've used with a peak of 245c & Alpha around the same although I try to keep that at no higher than 235C as we use it for LED arrays. If the peak is that low, is the liquidus te
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
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