Electronics Forum | Sat Nov 05 01:22:23 EST 2005 | koeka
All, We are having insufficient hole fill only at DIMM connector area(120 pin/row total two or 4 rows at that area) when we switch to lead free (SAC and Sn/Cu). The finish we using is immersion silver. Preheat on top side ~98-118oC. Rosin flux type.
Electronics Forum | Wed Feb 08 11:55:28 EST 2006 | dany
Hi all, we are manufacturing smt components and some weeks ago our customers are facing many problems related to weeting and solderability. I know it is due to the Lead free processes, but anyway, we are quite confuse. In case it was possible, what c
Electronics Forum | Thu Mar 09 16:29:35 EST 2006 | russ
Will the Pb part handle 240C? That is the first question that you need to answer. If it will then yes I would run the pbfree paste and profile. I assume that all other components are pbfree. If not, the same questions will need be asked as for th
Electronics Forum | Fri Oct 12 15:31:28 EDT 2007 | wayne123
I am needing to know if anybody uses a Reflow oven Chain oil that doesn't create a horrible smell. Whenever we put this oil on it burns off and smells like I am stuck at a stop light behind a car with bad rings. I have looked at several oils that adv
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Fri Dec 07 02:10:26 EST 2007 | mpolak
Hi, Could you guys verify my BTU VIP98N oven settings for lead free process. At the moment as my standard profile im using these settings 140 160 180 207 205 220 257 same temps for bottom and speed 50cm/min. Has anyone got same oven and could
Electronics Forum | Mon Dec 17 19:11:21 EST 2007 | bbarton
Have to agree with Steve. PROFILE PROFILE PROFILE It's the ONLY way with lead free. Think about it for a second...a process window about 1/3 the range of SnPb (assuming a 250 degree C max component temp) and you wind up with a fairly small target to
Electronics Forum | Wed Dec 10 09:29:59 EST 2008 | rgduval
Oops...just noticed you were referring to wave soldering. We'd still suggest a water-soluble flux, instead of the no-clean; especially at wave soldering. Also, checking pre-heat temps, and dwell time on the pot. Is the wave a chipper wave? If not
Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt
We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
