Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt
We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Fri Feb 17 17:41:23 EST 2023 | SMTA-71549289
We have a legacy Pillarhouse Jade and am not sure how long we can expect a nozzle to last. We're new to using selective solder and we have things going, but there are some details like this where we just don't know what a reasonable expectation can b
Electronics Forum | Fri Aug 25 07:38:12 EDT 2006 | CL
Hi CP, I used to work for a flex circuit manufacturer. I am at a CM now and am we have started building RoHS production status assemblies. I personally think flex circuits will have a difficult time with the required temps for RoHS. I spoke to someo
Electronics Forum | Tue Dec 15 12:23:47 EST 2009 | swag
I have moved golden boards from chains to mesh as I got tired of fishing t-couples under the chain rail. I saw a 3-5 deg. decrease on top-side parts peak temp. (all t-couples were on top side). I had to bump zones 6 and 7 a few degrees to make up f
Electronics Forum | Thu Nov 02 15:46:43 EST 2006 | rgduval
I'm looking for some information on soldering irons being used in my no-lead process. Specifically, my floor seem to be burning out tips at an alarming rate, when soldering lead-free assemblies. Today, I had one woman burn out a brand new tip in 4
Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN
so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do
Electronics Forum | Mon Apr 23 09:37:20 EDT 2007 | davepick
Assuming you are going to build using a Leaded part on a Lead Free Process - beware of Weak Joints. I saw this at a large Multinational company - They had secondary reflow on a Top Side QFP when the PCB went over the wave. We did pull strength tests
