Industry Directory | Consultant / Service Provider / Manufacturer
PFC Flexible Circuits Limited designs, manufactures, and assembles flexible circuits; single-sided, double-sided, multilayer and rigid flex. We are ISO 9001 and 13485 approved.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Used SMT Equipment | Repair/Rework
VJ Electronix Benchtop Solder Rework System Vintage: 2013 Model: SRT Micra Micro Assembly & Small Board Rework System High Resolution Vision System Convection Top & Bottom Site Heating Spot Heater 0.3mm Pitch Process Capability 01005
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
Technical Library | 2015-03-12 18:26:16.0
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.
MX200P has a IPC9850 Speed of 15,000CPH. 4 Modular Heads, 1 Precision Head, capable of inspecting and placing parts from 01005's (0402 metric) through 1.96"x 1.96" square, or 3.54" x 1.18" rectangular.Pitch capablity 12 mil, 80 feeder slots. All Mir
Used SMT Equipment | AOI / Automated Optical Inspection
CyberOptics FLEX ULTRA (2010) High Resolution Automated Optical Inspection Machine Brand: CyberOptics Model: FLEX ULTRA Year: 2010 Serial: 70246 Type: Automated Optical Inspection Machine Product details: The new Flex Ultra HR is the latest
Industry News | 2015-03-27 04:46:07.0
We are pleased to offer the widest range of online course topics in the industry. If we don't offer it send us an email and we may be able to provide a one off session for your company site. Successful Implementation & Quality Control of Conformal Coating Design & Assembly of 0201, 01005 and Next Generation Chips Lots more for 2015 at http://www.bobwillisonline.com
New Equipment | Assembly Services
Our extensive PCB assembly expertise incorporates: Prototypes and pilot builds Conventional electronics assembly Surface mount assembly State-of-the-art equipment RoHS and non-RoHS facilities Cost effective design Core to the JJS Electronics m
Industry Directory | Manufacturer
Prisma Electronics assembles PCBs with the use of SMT and Through hole. It is the only Greek Company who was honored with the Gold award for Industry by CERN, Geneva and takes part in ESA Projects.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
