Full Site - : 01005 pad (Page 5 of 17)

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-23 13:24:38.0

MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

SRT Micra - Mobile Device SMT Rework System

SRT Micra - Mobile Device SMT Rework System

New Equipment | Rework & Repair Equipment

Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN

VJ Electronix

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

JUKI RX-6 High Speed Compact Modular Mounter

JUKI RX-6 High Speed Compact Modular Mounter

New Equipment | Pick & Place

Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production

Juki Automation Systems

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

Technical Library | 2017-09-28 16:36:33.0

These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.

FCT ASSEMBLY, INC.

Six-Sigma Samsung Stencil Printer SMP400 Goes Online at ACI Demonstration Factory

Industry News | 2008-07-18 11:10:08.0

Samsung and Dynatech Technology have added the Samsung Stencil Printer SMP400 to the American Competiveness Institutes EMPF Demonstration Factory. The six-sigma capable printer joins the Samsung SM421 Advanced Flexible Mounter with STF100S Zero-Impact Side Tray Feeder, a complete IT feeder system with an offline programming station and IT Mobile Workstation.

Hanwha Techwin CO., LTD.

CyberOptics to Unveil Latest Inspection Equipment at APEX 2010

Industry News | 2010-03-22 14:13:32.0

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will feature its latest inspection equipment in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

CyberOptics Corporation

CyberOptics to Exhibit Latest Inspection Equipment at JISSO PROTEC 2010

Industry News | 2010-05-26 13:33:03.0

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will highlight its QX500™, SE350™ and SE500™ in booth 3D-03 at the upcoming JISSO PROTEC exhibition, which is scheduled to take place June 2-4, 2010 at the Tokyo Big Sight in Japan.

CyberOptics Corporation

PRIDE Industries Places Order for CyberOptics’ Flagship 3-D SPI System – the SE500™

Industry News | 2012-06-27 14:07:07.0

PRIDE Industries, Inc has purchased two SE500™ 3-D Solder Paste Inspection (SPI) systems for its manufacturing facility in Roseville, CA.

PRIDE Industries, Inc.

CyberOptics to Premier SE500 � 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-10 18:41:17.0

MINNEAPOLIS - January 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation


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