New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
Electronics Forum | Wed Jan 30 02:56:22 EST 2019 | robl
I'm with Steve and flying probing. As long as you are testing the capacitance of the cap in the circuit and not of the cap itself you'll get a pretty good indication. Most are going to be 10nf and 100nf decoupling caps at that size so quite easy to
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Industry News | 2003-03-07 08:04:13.0
Ansoft has upgraded its SIwave simulation software for the advanced modelling of leading-edge IC packages and PCBs, meeting a growing demand for fast and accurate signal- and power-integrity analysis.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices
| https://www.smtfactory.com/Advanced-Electronics-PCB-Assembly-SMT-Solutions-for-Computers-and-Phones-id46376637.html
Advanced Electronics PCB Assembly SMT Solutions for Computers and Phones - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
. Connect to a Single Point: Multiple ground connections create more noise so it’s best to simplify your design as much as possible. Reduce Loop Length: Connect bypass and decoupling capacitors to the ground plane to reduce the size of the loop and lessen EMI radiation
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