Electronics Forum | Wed Jul 29 21:16:17 EDT 2020 | SMTA-64387706
Hi, I have a PCB that works fine when tested before conformal coating with HumiSeal 1B73. It seems like the CC is causing electrical issues. We brush it on, so it is a bit thick. After curing we are getting QFNs that do not seem to connect well and a
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Thu Dec 18 13:07:50 EST 2014 | kevinb
I have worked with Epoxy Technology in the past with silver epoxy. Just to fill you in on what I have been doing with this project in the past. I was using a silver epoxy for my 0201s. I then over molded with an epoxy with a dam and fill. Then th
Electronics Forum | Tue Oct 11 19:57:04 EDT 2005 | hly
Hi folks, I had posted this earlier but I think there was some confusion on where the wrinkled joints were. The picture is the side view of a BGA soldered onto the PCB. I was able to take this picture becuase the BGA was at the edge of the board. I
Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake
Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
Electronics Forum | Wed Jul 28 07:59:50 EDT 2004 | cyber_wolf
Ken, With all due respect: Surface mount is surface mount. Whether you are placing 0201's, or PLCC84's the basic concept is the same. So I would surely hope that for the most part my process is transferable. I guess I was too broad when I said "we n
Electronics Forum | Wed Apr 26 14:06:46 EDT 2006 | mdm4ua
Hi JEM, We just made the very same upgrade you are looking to make on three machines. We purchased a new MY12 and upgraded our other three (My9 W/hydra, My9 No Hydra, and TP9-2U) from 2.2.4C to 2.4.4c. There are several changes and most of the
Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN
Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili
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