Used SMT Equipment | SMT Equipment
Product name: KE - 730 Product number: KE - 730 Products in detail Suitable for small components of high-speed SMT placement machine. As the single module module concept, can according to production capacity of flexible placement machine produc
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Parts & Supplies | Pick and Place/Feeders
Device name: JUKI FX-1, JUKI FX-1 slider, used JUKI FX-1 slider Equipment Profile JUKI FX-1 high-speed patch machine Product Model: JUKI FX-1 not only inherits the traditional concept of modular mount machine, but also realizes a high-speed mount
Industry News | 2018-10-18 09:48:34.0
How much does Automated PCB Assembly Cost?
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Industry News | 2014-12-17 19:57:30.0
Fuji's Scalable Placement Platform NXT III now supports 0201 mm (0.25 x 0.125 mm, 008004") components as standard. By loading the newly developed H24G head on the NXT III, 0201 mm (0.25 x 0.125 mm, 008004") components can be supported without any change to the specifications of the machine (speed: 35,000 cph, accuracy: ±25 μm). The Intelligent Part Sensor (IPS), which checks the orientation of parts on the nozzle and ensures that the part does not remain on the nozzle after placement, is standard on the H24G placement head.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2011-10-16 01:00:33.0
Cobar Solder Products will introduce its new halogen- and halide-free solder paste, Alpine OT2 in Booth #314 at the upcoming SMTA International Conference & Exhibition
