Electronics Forum | Tue Apr 13 12:56:16 EDT 2021 | robl
Hi Tonies, Do you place 0201's from any other supplier? if so, do you see similar issues on those parts? There are a lot of things that can go wrong on 0201 & 01005 that aren't the part manufacturer - part data, printing, placement, nozzle sele
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
Electronics Forum | Fri May 24 11:46:34 EDT 2002 | tmv
Lot's of good discussion in this string...but I think we've missed a few points. First off...turret machines are more than capable of handling the smaller component sizes (in fact, they are the best)...Machines like the SANYO TCM-3000 or Universal 47
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
