Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Parts & Supplies | Pick and Place/Feeders
NST feeders for CP series 8x2mm PA-NST for 01005 (= 0402 metric), red handle 8x2mm PA-NST for 0201 (= 0603 metric), green handle For SM series machines (400series, 321series: SM320, SM321, SM411, SM421) 8
Speed and Flexibility for High Quality Production of any PCB With maximum speed up to 42,000CPH (Optimum) and 29,000CPH (IPC9850), the RS-1 is designed for maximum throughput. The RS-1 supports components from 0201 metric (008004") up to 74mm squar
Used SMT Equipment | Pick and Place/Feeders
Feature Class leading speed, up to 47,000 cph Newly developed “Takumi Head” with changing recognition sensor height Optimum line balance and highest throughput Wide component range from 0201 (metric) to large connectors and ICs Optim
Used SMT Equipment | Pick and Place/Feeders
Feature Class leading speed, up to 47,000 cph Newly developed “Takumi Head” with changing recognition sensor height Optimum line balance and highest throughput Wide component range from 0201 (metric) to large connectors and ICs Optim
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
Used SMT Equipment | Chipshooters / Chip Mounters
The SIPLACE TX placement modules are the new standard in high-volume production. No other placement solution features this level of precision (22 µm at 3 sigma) and speed (up to 78,000 cph) in such a tiny footprint (only 1 m x 2.3 m). For the first t
Used SMT Equipment | Pick and Place/Feeders
SIPLACE SX1 Parameters： Gantries：1 IPC value：29,500cph SIPLACE benchmark value：37,000cph Theoretical value：43,450cph Machine size：1.5x2.4m Placement head feature: SpeedStar Component spectrums(mm²)：0201(metric)-6x6mm Placement accuracy：±41μm
Used SMT Equipment | Pick and Place/Feeders
SIPLACE SX1 Parameters： Gantries：1 IPC value：29,500cph SIPLACE benchmark value：37,000cph Theoretical value：43,450cph Machine size：1.5x2.4m Placement head feature: SpeedStar Component spectrums(mm²)：0201(metric)-6x6mm Placement accuracy：±41μm/3σ Angu
Used SMT Equipment | Chipshooters / Chip Mounters
The SIPLACE TX placement modules are the new standard in high-volume production. No other placement solution features this level of precision (22 µm at 3 sigma) and speed (up to 78,000 cph) in such a tiny footprint (only 1 m x 2.3 m). For the first t
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