Industry Directory | Manufacturer
Electronic Contract Manufacturer (Malaysia). Experience in lead-free production since 2001. Service: AI/SMT/Box Build, Turnkey. Component size 0201 and above. Capacity: 150KKpt/mth(2005)..
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
Contract electronics design and manufacturing service provider specializing in advanced electronic products. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection
Used SMT Equipment | AOI / Automated Optical Inspection
Post Print, Post Placement and Solder Inspection. Qty.48 1.4 Megapixel Images per Second 0201 Capable includes repair station PC This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit f
Used SMT Equipment | AOI / Automated Optical Inspection
includes repair station PC Post Print, Post Placement and Solder Inspection. Qty.48 1.4 Megapixel Images per Second 0201 Capable Facilities: 100-120V, 50/60Hz Dimms: 1500 lbs This unit is located in the CEE facility in the Chic
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
Used SMT Equipment | Screen Printers
The ultimate fine pitch printer Key Features • Self learning fiducial camera's. • Digital controlled Squeegee pressure. • All machine parameters are programmable and PC controlled. • Vision for board alignment using 2 CCD cameras. • Quick-lock c
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
Industry Directory | Consultant / Service Provider / Manufacturer
A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.
