500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Used SMT Equipment | AOI / Automated Optical Inspection
(2) Orbotech Automated Optical Inspections Machines For Sale Machine were just taken out of Military OEM facility in good working condition Both machines are being sold together at discounted price See attached pictures and information below
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Orbotech VT 9300 Vintage : SEP 2004 *With Calibration Card *Boards Inspected: Post-solder SMT, through-hole and mixed technologies *Number of CCD Cameras: 13 Cameras *Fault Coverage: Component placement accuracy in X, Y and Q,
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2008-08-07 15:31:41.0
NASHVILLE � August 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will both present and chair technical sessions during the 2008 SMTA International Conference and Exhibition, scheduled to take place August 18-20, 2008, at the Coronado Springs Resort in Orlando, FL.
Parts & Supplies | Pick and Place/Feeders
SMT YAMAHA 0201 KW1-M1500-00X pick and place nozzle Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha CL 8*4mm Feeders KW1
Parts & Supplies | Pick and Place/Feeders
SMT YAMAHA 0201 KW1-M1500-00X pick and place nozzle Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha CL 8*4mm Feeders KW1
Technical Library | 2021-09-01 15:31:39.0
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices
