Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
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Features & Benefits: One platform solution for any kind of production Commonality with existing equipment Linear motor drive increases reliability and reduces maintenance Wide component capability from 0402 (01005) chips to 90 x 100mm on up to 18" x
Used SMT Equipment | Chipshooters / Chip Mounters
Model:YG12 Placement Speed:36000cph(0.1sec/CHIP Equivalent) Placement Range:0402(Metric base )to□20mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1254XW1440XH1450mm Weight:1340kg
Used SMT Equipment | Chipshooters / Chip Mounters
Model :FX-2/FX-2C Placement speed：Chips:40000CPH*2(0.09sec/chip) Component mount range:0402 chips ~33.5mm Station:80 Power supply:3-phase AC200~415V 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg
Used SMT Equipment | Chipshooters / Chip Mounters
Model:YV10011 Placement Speed: Chips :14400cph(0.25sec/chip) Placement Range:0402 chips ~25mm Placement Station:100 Power Supply:3P/200V-415V/3KVA Dimensions:1650X1358X1810mm Weight:1300kg jenny@ksunsmt.com
Used SMT Equipment | SMT Equipment
Model :FX-3R Pick and Place Machine Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Used SMT Equipment | SMT Equipment
Model :KE-3020R Pick and Place Machine Placement speed：Chips:20900CPH(0.172sec/chip) Component mount range:0402 chips ~74mm Power supply:200to415VAC, 3-phase 2.2KVA Size:1975*1690*1530mm Weight:2100kg
Used SMT Equipment | SMT Equipment
Model:YG300 SMT Pick and Place Machine Placement Speed:105,000cph(0.034sec/CHIP Equivalent ) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L2770XW2118 Weight:4.400kg
Used SMT Equipment | SMT Equipment
Model:YV10011SMT Pick and Place Machine Placement Speed: Chips :14400cph(0.25sec/chip) Placement Range:0402 chips ~25mm Placement Station:100 Power Supply:3P/200V-415V/3KVA Dimensions:1650X1358X1810mm Weight:1300kg
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
