Electronics Forum | Wed Jan 07 07:50:24 EST 2009 | ludee_circuits
I think so. My customer once assembled resistors 0402 ,by Glue+wave soldering process. But PCB must be printed soldermask bridge between 0402 SMD PADs, otherwise you would encounter short problem. Sorry I don't have any comment for recommended footp
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed Feb 26 15:27:21 EST 2003 | robert valles
Sounds like someone before you was dealing with tombstoning components. We have had greater success with triangular paeratures for 0603 and 0402 footprints. Granted the pad will not be wetted completly but IPC requirements are maintained.
Electronics Forum | Mon Sep 18 11:30:43 EDT 2006 | aj
Hi All, What is the difference between the above? Came across some conflicting design rules between the two - in particular 0402 smt footprint. aj...
Electronics Forum | Fri May 12 05:47:18 EDT 2000 | Wolfgang Busko
Just another thing to look at: Look in the archives of IPCs technet. There I found this interesting this interesting link http://www.plexus.com/In_The_News/Papers/papers.html and an interesting article (in PDF format) about "tombstoning of 0402's a
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Mon Aug 21 04:20:49 EDT 2006 | Rob
Hi Mika, I used to work for the largest chip cap manufacturer in the world, and by far the largest problem we would see was cracking due to incorrect z height adjustment on Chipshooters. It can also cause solderballs and bad joints by displacing th
Electronics Forum | Wed Oct 14 22:05:45 EDT 1998 | Jason
John, Universal has a smaller footprint HSP chipshooter, I believe the 4795S and the 4796R that takeup a lot less space than the full sized chipshooters do. I have a 4795S, it's just as reliable as our full sized 4795's & 96's. As far as BGA's I pr
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
