Full Site - : 0402 land patterns (Page 12 of 45)

VJ Electronix, Inc.'s SRT Micra Rework Platform Bestowed with Another Industry Award

Industry News | 2011-05-16 14:54:48.0

VJ Electronix announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Rework/Repair Tools for its SRT Micra Rework Platform. The award was presented to the company during a May 12, 2011 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2011.

VJ Electronix

Practical Components to Exhibit Its Latest Technologies at productronica 2013

Industry News | 2013-10-09 14:03:07.0

Practical Components announces that it will showcase its latest technology in representative AAT Aston GmbH’s booth in Hall A2, Stand 558 at the upcoming productronica International Trade Fair, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Center in Munich, Germany.

Practical Components, Inc.

Debbie Carboni to Present “Design for Cleaning” at SMTA Philadelphia Expo

Industry News | 2014-07-15 14:38:39.0

Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.

KYZEN Corporation

Practical Components to Exhibit Its Latest Technologies at APEX 2015

Industry News | 2015-02-10 17:26:13.0

Practical Components announces that it will display its latest technology in booth 3939 at the upcoming IPC APEX EXPO 2015 exhibition and conference, scheduled to take place February 24-26, 2015 at the San Diego Conference Center in California.

Practical Components, Inc.

Practical Components to Exhibit Its Latest Technologies at Productronica 2015

Industry News | 2015-11-03 10:54:44.0

LOS ALAMITOS, CA — November 2015 — Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November 10-13, 2015 at the New Munich Trade Fair Center in Munich, Germany.

Practical Components, Inc.

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Industry News | 2016-09-23 15:41:59.0

Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

Akrometrix

Scratch and film testing throughput greatly enhanced

Industry News | 2016-12-21 11:15:14.0

Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.

XYZTEC bv

Scratch and film testing throughput greatly enhanced

Industry News | 2016-12-21 11:15:27.0

Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.

XYZTEC bv

Practical Components to Exhibit Its Latest Technologies at iMAPS 2018

Industry News | 2018-10-02 17:16:16.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.

Practical Components, Inc.

Practical Components® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Industry News | 2018-10-15 18:31:07.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.

Practical Components, Inc.


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