Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Wed Jun 17 16:00:47 EDT 1998 | Frank
| | Does any one wave solder the 0402 Chips on the bottom side of a board? | | Any comments? | You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the
Electronics Forum | Wed Jun 17 14:45:45 EDT 1998 | Bob
| Does any one wave solder the 0402 Chips on the bottom side of a board? | Any comments? You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the lands
Electronics Forum | Fri Apr 01 14:51:23 EDT 2011 | jaimebc
We are currently experiencing a high rate of false calls on our 0402 chips. Resistors for the most part. Has anybody out there found a setting where this false calls are minimized? We are using top red light, pattern inspection,color inspection ( wh
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Thu Oct 20 10:31:27 EDT 2011 | ck_the_flip
What is the industry standard pad geometry (dimensions and spacings) for 0402 components?
Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno
Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Thu Nov 02 17:15:34 EST 2000 | Erdem Bilaloglu
We are using semi-circular land pattern and 0.004" smaller appertures on screen. With stable rising slope (max:2.6degC/sec)we have not experienced any tombstonning so far.
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
