Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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Parts & Supplies | Pick and Place/Feeders
F1-82-1005 LG4-M2A00-040 YAMAHA FEEDER Condition: New Stock: Yes Packaging: Cleaning Transportation: Ocean,Land,Air Place of Origin: Dongguan HS Code: 8479909090 YAMAHA Feeder in Stock YAMAHA CL KW1-M1500-030 8MM 0201 8X2 YAMAHA CL
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Industry News | 2013-05-20 16:19:35.0
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
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KW1-M531D-000 Yamaha Feeder Spring Condition: New Customized: Customized, Yes Stock: Yes Packaging: Cleaning Transportation: Ocean,Land,Air Yamaha nozzle features: A: Special nozzle forming an organic whole, to ensure its precision. B: Nozzle inner
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
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