Electronics Forum | Tue Jun 24 12:56:26 EDT 2014 | jmathis
Hello, As our company has begun doing an increase production of contract manufacturing I have seen more and more designs with the 0402 pad layouts that are smaller (.015 in width) than the component. Also there is only a .008 longer than the 0402 p
Electronics Forum | Mon Jun 11 14:25:36 EDT 2001 | CPI
I had the very same problem but, did not question my oven as I knew the profile was good and I should have had even heating. So I then looked at pad size and layout. When Layout and size were found to be ok. I attached a prob to each pad and ran a pr
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Wed Apr 12 21:33:27 EDT 2000 | Micah Newcomb
Billy and Chris have a good point, pad size and geometry will affect proper aperture size and geometry and could result in tombstoning. Also I have seen chips which require special pastes but I have never found this to be the cause of tombstoning, in
Electronics Forum | Thu Apr 11 05:47:21 EDT 2002 | ianchan
Hi everyone, Does anyone have experience and applications knowledge, to help recommend a singulation machine? for depanelization process of a : 1) 0.65mm thickness PCBA, with 0603/0402 SMD, 2) with materials composition makeup of a 1.5oz copper,
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Tue Feb 22 10:44:12 EST 2005 | Dougs
when you talk about stencil design, what would you recommend for aperture size on fine pitch if the customer insists on hasl finish on fine pitch devices? i usually use a 10% reduction on everything we have been using ( 16mil pitch and upwards and 0
