Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Tue Nov 02 14:36:02 EST 1999 | Anthony Winston
Does the possibility exist where one can calculate the movement of a SMT component during reflow given component and pad geometries? Thanks in advance.
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Wed Mar 20 19:10:43 EST 2002 | rmerk
I would like to know if there are any detailed studies or sources of information regarding the use of round pads vs square pads with chip components (0402 and greater).Thank you.
Electronics Forum | Tue Aug 24 16:11:21 EDT 1999 | Scott Cook
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Tue Mar 20 14:35:20 EST 2001 | mnaddra
We have had a similar issues with some of our boards , However I took a different approach to the solution that I thought I would mention. There is a company Called Additive Services Inc. 603-889-1999. They have developed a process to screen lands an
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Fri Oct 06 09:16:10 EDT 2000 | Kev Head
All, We are planning to place a daughter board that has a surface mount relay reflowed onto it already. The reason for doing this is a bit complicated and not worth noting here. The process would consist of first placing the SMT relays onto a mult
Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
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