Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
Industry News | 2012-01-30 13:43:45.0
Seika Machinery will highlight many new, innovative products at the upcoming SMTA Dallas Expo and Tech Forum.
Industry News | 2012-05-31 21:23:25.0
Seika Machinery, Inc. will display its new and innovative products at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2009-11-02 21:58:24.0
OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.
Industry News | 2005-07-11 12:52:53.0
Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463
Industry News | 2019-12-16 22:05:41.0
In recent years, as a subdivision of the LED industry, UV LED industry has developed in full swing. In 2019, the UV LED industry is in the buffer phase of application explosion, and the most urgent task for relevant companies is to launch the technology war, in order to capture as many places as possible before the real market explosion.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Technical Library | 2023-05-02 18:50:24.0
Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process. Given the miniaturized dimensions of an 0201 package, it is crucial that the mounting process abide by a series of guidelines regarding the design of the PCB mounting pads and solderable metallization, PCB circuit trace width, solder paste selection, package placement and overages, solder paste reflow, solder stencil screening, and final inspection. It's advisable that one review this information when procuring the services of a PCB assembler.
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
