Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Tue Jun 14 15:03:15 EDT 2005 | slthomas
In that the machine times out and waits for a feeder refill and doesn't just skip that part and leave the space empty, it's not a defect. I have found 500ppm *fairly* easily attained in SMT depending on the board mix and how you define (1) a defect,
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
Electronics Forum | Wed Aug 05 08:16:34 EDT 2015 | emeto
Hi, that's how it works: 1. Zoom to the object you want to start with. 2. Click S to center to the object. Depending on the zoom you can center to pad, line, corner.... 3. Click Z(this zeroes your Relative coordinates). If you click Ctrl+z(this ze
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
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