Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Wed Apr 12 21:33:27 EDT 2000 | Micah Newcomb
Billy and Chris have a good point, pad size and geometry will affect proper aperture size and geometry and could result in tombstoning. Also I have seen chips which require special pastes but I have never found this to be the cause of tombstoning, in
Electronics Forum | Tue Sep 08 13:12:05 EDT 2020 | spoiltforchoice
> Tombstone is often caused by an imbalance of > temperature, pad shape or spacing, component > termination, and component positioning. Pate > formulation and reflow atmosphere are other > common causes. Looking at the pads and &
Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F
snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad
Electronics Forum | Tue Dec 21 19:48:27 EST 1999 | Russ
John, we have waved 0603 packages for a long time, We have also started on 0402. Are you concerned with shorting across the component body or to other components? You should have no problems with these parts in a wave process. A couple of things
Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon
| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'
Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon
| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t
Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox
| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p
Electronics Forum | Thu Apr 19 21:49:29 EDT 2001 | davef
SCREENING... 1. Is type 4 paste necessarily required? [No, not unless you are using it for some other purpose.] 2. Is No-Clean Ok to use? [YES] 3. How thin stencil is required? 5 mils? [5 is OK, but I wouldn�t base the decision on the 0201. 6 mil is
