Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
Electronics Forum | Tue Jun 29 04:45:10 EDT 1999 | Earl Moon
| | Hey there gang, how's it going ? | | | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my componen
Electronics Forum | Wed Jun 30 10:00:33 EDT 1999 | Mcox
| | | | | | | | snip | | | | | | | | | John and Dave, | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the pa
Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon
| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Wed Feb 07 11:19:23 EST 2001 | CAL
Precision parts and precision boards are nice for the initial evaluation but are costly for routine monthly accuracy tests. I know for a fact all the Siemens machines leaving Germany are evaluated with precision parts and board and placements are eva
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Wed Jun 30 15:24:23 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable res
Electronics Forum | Wed Jun 30 13:48:57 EDT 1999 | JohnW
| | | | | | | | | | | | snip | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as ot
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