Full Site - : 0402 shelf life (Page 17 of 69)

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Industry News | 2019-01-14 19:51:49.0

Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).

Finetech

MAXWELL ANNOUNCES FIRST EVER AUTOMATED INTEGRATED RELIABILITY TEST SYSTEMS FOR ADVANCED WIRELESS SEMICONDUCTOR COMPONENTS

Industry News | 2002-05-16 16:53:54.0

New Family of 12 Automated Accelerated Reliability Test Systems (AARTS) Starting at $99K

Maxwell Technologies, Inc.

Krayden Debuts Dow Corning Solar Solutions’ Solar Junction Box and Frame Sealing Using Reactive Silicone Hot Melts

Industry News | 2010-06-04 17:32:40.0

DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, introduces Dow Corning Solar Solutions’ PV InstantSeal. This silicone reactive hot melt supports higher-speed assembly with instant green strength, offering productivity improvements in both solar frame and junction box sealing.

Krayden Inc.

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Industry News | 2013-04-08 19:29:43.0

AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

AIM Solder

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Sanmina-SCI Installs ICON-SCM Supply Chain Management Software

Industry News | 2003-04-09 09:05:06.0

ICON Industry Consulting, Inc., a supply chain management solution specialist, today announced Sanmina-SCI Corporation (Nasdaq: SANM), a leading supplier of integrated design and electronics manufacturing solutions (EMS), is using ICON's SCM software to significantly improve production efficiency in a number of its fulfillment centers.

Sanmina-SCI

parvus Corp.'s PC/104-Plus Power Interface Generates 3.3Volts for PC/104-Plus Peripherals

Industry News | 2003-06-04 14:52:19.0

PC/104-Plus Power Interface Converts PCI and ISA Voltages and Provides Thermal Management via Dual Onboard Fans and Temperature Sensor

Parvus Corporation


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