New Equipment | Cleaning Agents
220°F~104°C Boiling Point 280°F~138°C Water Soluble Complete VOC, @10% 90.0 g/L Typical Processes: Application Spray
New Equipment | Cleaning Agents
220°F/104°C Boiling Point 240°F/115°C Water Soluble Complete VOC, @10% 88.9 g/L Typical Processes: Application In-Line
With a combination of specialized processes and equipment, the boards were custom manufactured from double-sided glass-reinforced PTFE. This PCB is used for controlled impedance within a microwave application.. Utilizing advanced photolithography a
New Equipment | Board Handling - Storage
The Dr.Storage T40W are plug and play, fully auto dry cabinets which can bake at a stable 40℃ and maintain a consistent The T40W Baking Cabinets Series has a double wall design to ensure it maintains a stable According to J-STD-033B, using a T40W
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
New Equipment | Cleaning Agents
Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX® A4638 is designed to remove water s
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
