Industry Directory | Manufacturer
Contract manufacturer of hybrid ICs and PCB assemblies
Industry Directory | Manufacturer
S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand
KS-800 New High-precision multi-functional LED SMT Pick and Place Machine, eight head in one take and stick, low energy consumption; independent research and development of integrated light weight,all 8 sets of Z-axis are controlled by independent mo
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist
On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Parts & Supplies | Soldering - Wave
ELECTROVERT V STYLE, THICK, TITANIUM FINGER PN 3-0257-242-01-03 (EF07)
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
GPD Global | https://www.gpd-global.com/solder-paste-dispense-systems.php
Solder Paste Dipsense Systems -Dots, Lines, Complex Shapes, 01005, 0402 Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Heller Industries Inc. | https://hellerindustries.com/parts/7729k/
7729K - ARMAFLEX INSULATION (1MX1MX25MM thickness) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
