Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Parts & Supplies | Chipshooters / Chip Mounters
Samsung SM481 Chip Mounter Focus on the way flight vision + fixed vision (optional) Number of axes 10 axes * 1 gantry Mounting Speed 0603 39000 (Best Conditions) Mounting accuracy chip ± 50um @ 3ó / chip, QFP ± 30um @ 3ó / chip Component Ra
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
