Full Site - : 0603 tombstoning (Page 13 of 14)

pcb board deflection when mounting component

Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007

Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner

Re: Skewing chip components

Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea

Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 11:58:29 EDT 2004 | Dreamsniper

I've worked with a Vapor Phase Oven a semi-automatic and a manual oven for evaluation. They worked fine and produce better grain of solder joints. The fluid that you need depends on the solder temperature that you require. I've used a 200'C fluid for

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

Tombstone caused by flux residue

Electronics Forum | Thu Jul 14 04:28:45 EDT 2005 | lloyd

Folks, Thanks for all the info and suggestions but let me add a bit more to the pot. Our products work in a harsh environment and are classed as safety critical. Customer returns are our biggest concern, we don't get very many and feeling here seem

0201s

Electronics Forum | Thu Apr 19 21:49:29 EDT 2001 | davef

SCREENING... 1. Is type 4 paste necessarily required? [No, not unless you are using it for some other purpose.] 2. Is No-Clean Ok to use? [YES] 3. How thin stencil is required? 5 mils? [5 is OK, but I wouldn�t base the decision on the 0201. 6 mil is

Manufacturers of

Electronics Forum | Sat Dec 04 18:55:38 EST 2004 | Grant

Hi, Yes, all you really need to do is boil the fluid while suspending the PCB above the vapor, so it's quite easy. However I would recommend against dropping the board direct into the vapor cloud, as that would be a very fast warm up, while letting

63/37 Solder Paste mix

Electronics Forum | Fri May 11 09:56:58 EDT 2012 | cyber_wolf

Paste control is a subject that has a lot of unfounded claims surrounding it. What is the difference in having a "working paste jar" and a "new paste jar" Either way new and old are getting mixed at some point. We just don't buy onto the whole thing

Batch Ovens

Electronics Forum | Wed Nov 02 17:49:07 EST 2005 | grantp

Hi, We used a batch oven from Reddish Electronics out of the UK. It was convection, and ok, but had limitations. Batch convection ovens start to heat up, so the metal of the oven is hotter and hotter and it effects the profile. So we ended up need


0603 tombstoning searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Component Placement 101 Training Course
PCB Handling Machine with CE

Stencil Printing 101 Training Course
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications