Electronics Forum | Thu Apr 26 18:39:45 EDT 2001 | jagman
I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepabl
Electronics Forum | Fri Sep 02 14:15:44 EDT 2005 | Mika
Check the dimensions of the components in question with a caliper and put the correct numbers in Your part data. Check that the correct nozzle is being used. Also make sure that you have the right pcb height in Your program. This is somewhat criti
Electronics Forum | Thu Jun 26 21:38:31 EDT 2003 | Dreamsniper
Hi Guys, Need your good advice about this for a 5 thou stencil thickness: 0603 pad is 50mil x 40mil 0805 pad is 75mil x 45mil 1206 pad is 70mil x 50mil I want the above apertures to be in IPC STD Homeplate Design + an area reduction of 15%. Will t
Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Tue Mar 23 10:16:22 EST 1999 | Chrys Shea
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Fri Dec 03 13:08:40 EST 2004 | Dreamsniper
The voids are between the interface of the pad and the solder joint of component chips. I have a good thermal profile and this problem occured only on certain product so since we have some common components, component termination contamination is no
Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty
| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what
Electronics Forum | Mon Feb 07 14:25:43 EST 2011 | rodrigo
Hi all, This machine is pretty good. Thanks to all that have been helping me out with this. I have another question ... Some PCB have footprints that are a bit larger than the actual part (0805, 0603) so they move when they go through the reflow ove
Electronics Forum | Thu May 26 11:21:14 EDT 2011 | asksmt
Hello Guru's, I am using IPC-7351 LP Calulator to design Footprint (0603, 0805, 1206, SOT-23, etc) for all SMT Parts. Our Production Recently commented that they have included Red Glue Machine inhouse and will use Wave Soldering for Both Thru-hol
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
