500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
Electronics Forum | Mon Jan 14 10:35:27 EST 2008 | swag
GEB - We have a 1.0 mil camera for GSM1 that we do not use. We would prefer to have a 2.6 mil on our machine. Are you interested in a trade?
Electronics Forum | Fri Sep 23 09:53:33 EDT 2005 | PWH
Thanks all for the opinions. Our shuttle/GSM1/PTF install was done by an ex-UIC engineer. Have never utilized shuttle so appreciate the advice on pros and cons of it all. We have 1.0 mil on PTF side and 4.0 on shuttle side. C4 head on both sides
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel. pec beam 2 firewire
Used SMT Equipment | Pick and Place/Feeders
Serial: 10101112 Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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