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Fiber exposed on board edge

Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef

IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th

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10.2.6
ipc 610 10.2.6
ipc-610-e 10.2.6 they say should not exceed 1.5% for pth or 0.75% for smt
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