Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Used SMT Equipment | Pick and Place/Feeders
Includes Parts Tray Feeder OS: Windows XP SW: 8.3.0.10 Cameras: Front ULC magellan firewire 1394 .94 mil per pixel. Rear ULC firewire 2.3 per pixel. Pecs: pec beam1 firewire 1394 .66 mil per pixel. pec beam 2 firewire 1394 .
Used SMT Equipment | Pick and Place/Feeders
Machine Type YS12F Applicable PCB L510mm x W460mm to L50mm x W50mm Mounting accuracy Absolute accuracy（μ＋3σ） +/-0.05mm/CHIP Mounting tact 20,000CPH（under our optimum condition） Component supply Tape reel, tray Number of
Used SMT Equipment | Coating and Encapsulation
Model: PVA650 Vintage: December 2008 Description: Conformal Coat Details: • Software 3.0.0 Build 106 • 120 Vac, 60 HZ,12 Amps • PCB Max 18x18x4 Condition: Complete & Operational Location & Shipping: US
Industry News | 2019-03-31 20:31:57.0
IPC — Association Connecting Electronics Industries® announced today the February 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and orders both experienced solid year-over-year growth in February and the book-to-bill ratio strengthened to 1.06. Based on revised data from the industry, January business results made a much stronger showing than originally reported.
Used SMT Equipment | In-Circuit Testers
Genrad / Teradyne In-Circuit Tester For Sale Taken offline in Good Working Condition Serial Number 106Model Number: TS87L-9701-00Windows O/SETL Listed / CE MarkedConfigured with the following (35) boards reading from left to right9004-039900A2277-471
Industry News | 2011-01-18 14:37:31.0
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Industry News | 2015-08-10 17:07:47.0
IPC announced the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders were up and the book-to-bill ratio strengthened to 1.06.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
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