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Samsung MSMA152A1C Samsung CP45 Motor 1500W

J90551228A_AS SM431_BALL_SPLINE_ASSY(CS?1?71?1?773?1?71?1?770) J2500457 PITCH PAWL SPRING [TF08-020J] J7000798 SPROCKET ASS’Y [TF44S (C/S)] J7065566A LOCKER SPRING[TF08-Q164] J8100128A FORMING BRACKET[NST08-2P / NST08-4P] J81001283A FWFD-090-0

KingFei SMT Tech

Voids in Solder Joints

Technical Library | 2019-12-12 21:43:43.0

Presented at SMTA Boise Expo and Tech Forum, March 20, 2018

Intel Corporation

Cost effective solution in SMT production: AI and Big Data

Technical Library | 2017-12-12 01:43:55.0

In recent years, more and more companies with SMT production floor are trying to become more efficient and cut production costs. In most cases, the treatment was carried out problematic processes that visible and easy to find. Now these companies came to look problematic processes that are invisible and hard to find.

Proventus Technologies

Panasonic CM212 12+12, 12+8, 8+3

Used SMT Equipment | SMT Equipment

Panasonic CM212 Configuration : 12+12 12+8 8+8 OR 8+3 with Tray 2 sets available, For SALES customerst@163.com

Customer Satisfaction Technology Company

How to improve reliability of PCB equipments

Technical Library | 2012-12-12 03:17:51.0

When we designed the PCB equipments, we should try to simplify crcuit and structure design that on the premise of ensuring the equipments to meet the technology and performance, In modern society, modules design (MD)is a effective measures to improved the pcb equipment reliability. The system were made up simpleness functions of modules to reducing the complexity of the design. Both domestic and abroad, a large number of facts have proved this point, MD was a best choice for PCB equipment design.

Everest PCB equipment Co.,Ltd

Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods

Technical Library | 2013-07-18 12:12:40.0

Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.

Department of Chemical Engineering, University of Massachusetts