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Panasonic CM212 12+12 /8+3 with tray

Used SMT Equipment | Pick and Place/Feeders

Panasonic CM212 12+12  8+3 with tray for sale. Welcome to contact me if wanted.

MePow Technology Company Ltd

Panasonic CM212 12+12/8+3 T

Used SMT Equipment | Chipshooters / Chip Mounters

Panasonic CM602/212/402: 12+12/8+8 /8+3 with Tray available for sale. Machine in good working conditions. 2006-2010 vintages .

MePow Technology Company Ltd

Panasonic CM212 -M  12+12  8+3 +Tray

Panasonic CM212 -M 12+12 8+3 +Tray

Used SMT Equipment | Chipshooters / Chip Mounters

Panasonic CM212-M  machine for sale, CM212 12+12 + CM212 8+3 + Tray

MePow Technology Company Ltd

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

Technical Library | 2018-05-23 12:12:43.0

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.

Robert Bosch LLC Automotive Electronics Division

Assembly Reliability of TSOP/DFN PoP Stack Package

Technical Library | 2018-12-12 22:20:22.0

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.

Jet Propulsion Laboratory

Panasonic CM602 12+12  8+3 + Tray

Panasonic CM602 12+12 8+3 + Tray

Used SMT Equipment | Chipshooters / Chip Mounters

We have panasonic CM602 12+12  12+8  8+3  ..  option machine for sale. welcome to contact me if  you wanted.

MePow Technology Company Ltd

kimron technologies ltd

New Equipment |  

production of electronic products , assembly lines

kimron technologies

Panasonic CM402-M KXF-4Y3C 12+12

Panasonic CM402-M KXF-4Y3C 12+12

Used SMT Equipment | Chipshooters / Chip Mounters

Model ID:CM402-M Model No.:KXF-4Y3C Serial No.115Z3455 Manufactured Year:2007

Shenzhen GuangAn FuQiang equipment Co., Ltd.

Panasonic CM602L (12+12) DT401F NPM

Panasonic CM602L (12+12) DT401F NPM

Used SMT Equipment | Chipshooters / Chip Mounters

We have one of CM602L(2008)  and two (2012) with 12+12 head or 8+3 heads with tray We also have CM402L 8+3 with Tray ,NPM-W with Tray ,DT401F with tray  All machines are  in my warehouse ,If you have interested please contact with us to get mor

Shanghai Shihua Engineering Industry CO.LTD


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