New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes
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Industry News | 2009-05-29 12:33:55.0
Siemens is taking another step into the fast growing SMT (Surface Mount Technology) industry in India. The launch of the first SIPLACE training demo centre at the Nettur Technical Training Foundation (NTTF), in Bangalore reflects Siemens' enterprising response to the rapidly changing market requirements.
Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking a Sr. Quality Engineer to join thier team! The Sr. Quality Engineer will act as the right hand man to the Quality Manager. Provides work direction for Quality Technician and Product/Process Auditors po
New Equipment | Test Equipment
Promax ET-836 General Equipment $9940.35 The Telephony Trainer ET-836 is an educational integral system destined to the learning of the theory and the practise of PABX stations, the indoor telephony networks and the telephony systems, as well as t
Parts & Supplies | THT Equipment
Complete anvil cut clinch assembly from a 6241 VCD inserter, good condition.
Industry News | 2001-12-17 03:12:33.0
Swiss company MC-SOFT in Peseux Switzerland is taken over by ESSEMTEC LTD
Industry News | 2009-01-19 00:12:33.0
MADISON, AL � January 2009 � STI Electronics, Inc., a full service organization providing training, distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, hires industry veteran Jim MacAniff.
Industry News | 2010-06-23 12:33:29.0
FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
