EKRA printer E4 & E5 Width: 300 mm Length: 10 m 20 rolls / box. For more information please visit our website
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes
Electronics Forum | Wed Jan 05 12:33:01 EST 2000 | Vahid Vatannia
Thanks for the info. I am going to call AMP and ASG. Thanks again.
Electronics Forum | Tue Jun 04 12:33:57 EDT 2002 | dason_c
We use the diamond shape on the CBGA/CCGA only, all the PBGA are using the regular round shape.
Used SMT Equipment | Soldering - Selective
2015 Juki Cube 460 Selective Solder Make: Juki Model: Cube 460 Vintage: 2015 Description: Selective Soldering Machine Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay Please contact us di
Industry News | 2018-10-02 12:33:11.0
IPC announced today the August 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for August held steady at 1.05.
Industry News | 2012-01-03 12:33:17.0
IPC announced the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Parts & Supplies | Circuit Board Assembly Products
YAHAMA SMT YG12F , YS12F the image processing board. KHL-M441H-23X VISION BOARD ASSY KHL-M441H-23 VISION BOARD ASSYKHL-M441H-231 VISION BOARD ASSY Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.
Parts & Supplies | Pick and Place/Feeders
JUKI nozzle P/N list: 40010999 NOZZLE ASSEMBLY 500 CVS 1 40011046 NOZZLE ASSEMBLY 500 1 40001339 NOZZLE ASSEMBLY 501 1 40001340 NOZZLE ASSEMBLY 502 1 40001341 NOZZLE ASSEMBLY 503 1 40001342 NOZZLE ASSEMBLY 504 1 40001344 N
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Career Center | Houston, Texas | Engineering,Production
We have been hired again by the hour to find an Electronic Engineer for this growing CM Will be on pcba NPI team with mechanical and manufacturing engineers.
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
