Industry Directory | Manufacturer
Our specialties are: Contract Electronic Manufacturing (CEM)
Industry Directory | Manufacturer
Lear Corporation is one of the world's largest suppliers of automotive interior systems and components. Lear provides complete seat systems, electronic products and electrical distribution systems and other interior products.
New Equipment | Cable & Wire Harness Equipment
Low Cost Table Top Crimp Machine. The C 200 is a table top low cost crimp tool which takes a variety of dies from different manufacturers. Air operated using standard factory air (5 bar min), with a pressing capacity of up to 1,200 kp, this portable
Entry Level Foot Valve Dispensers. The TS924 dispenser offers the best of both worlds: increased production combined with dispenser economy. Floor mounted, they have a built in pressure regulator, pressure gauge and a unique fast-dump, three-way air
Electronics Forum | Fri Jan 25 08:54:33 EST 2019 | dfl
For the first time, I'm really looking at to the power transformer for the IV-C pick and place (the big big one, at the middle). As I understood, is this transformer converting the 220V to 127V? I realize that the camera monitor is 127V and the PC PS
Electronics Forum | Mon Apr 04 22:07:15 EDT 2005 | Dhanish
Questions and answers - what Column pitch do your CCGA have ? a) 1,27 mm?b) 1.00 mm? 1.27mm - how are the PCB pad finisched ? OSP Enig? HAL? OSP - Are you using Clean or NC solder paste? Clean
Used SMT Equipment | Pick and Place/Feeders
This pick & place machine is one of the many featured items in our upcoming online auction. Find it in lot #65. Bidding takes place between 12/4 and 12/7. Click the catalog link to view more details!
Used SMT Equipment | Pick and Place/Feeders
This pick & place machine is one of the many featured items in our upcoming online auction. Find it in lot #60. Bidding takes place between 12/4 and 12/7. Click the catalog link to view more details!
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Parts & Supplies | Pick and Place/Feeders
SANYO Feeder Parts Part Name：ASSY,DISK ( TF 8MM带轴承內盖 ) PART No：630 108 7276 Part Name：LEVER(SHUTTER LEVER ASSY) PART No：630 059 7806 Part Name：LEVER(RATCHET CLICK) PART No：630 039 3040 Part Name：ASSY,LEVER PART No：630 106 6462 Part Na
Parts & Supplies | Pick and Place/Feeders
SANYO Feeder Parts Part Name：ASSY,DISK ( TF 8MM带轴承內盖 ) PART No：630 108 7276 Part Name：LEVER(SHUTTER LEVER ASSY) PART No：630 059 7806 Part Name：LEVER(RATCHET CLICK) PART No：630 039 3040 Part Name：ASSY,LEVER PART No：630 106 6462 Part Na
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Career Center | Middleboro, Massachusetts USA | Production
Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario
SMTnet Express, February 25, 2016, Subscribers: 24,127, Companies: 14,992, Users: 40,012 ph Neutral Cleaning Agents - Market Expectation & Field Performance Umut Tosun, Jigar Patel, Kalyan Nukula, Fernando Gazcon, ZESTRON America; ZESTRON
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/valves/127-1-part-snuf-bak-series
127 1-Part Snuf-Bak Series Nordson SEALANT EQUIPMENT Corporate | Global Directory | Languages Division Only All of Nordson Products Valves Meters
