FUJI NXT Applicable Components: 0201 Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT Chip Mounter, High Speed modular Mounter, Applicable Components: 0201,Board size:330×250mm,Feeder inputs:20,
FUJI NXT Chip Mounter Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT Chip Mounter, High Speed modular Mounter, Board size:330×250mm, Feeder inputs:20, placement capacity
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Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
Electronics Forum | Wed Sep 08 06:22:51 EDT 2004 | Tore
Hi all, There seems to be a problem with the major component vendors/manufacturer everywhere; to supply lead free dummy/daisy chain components, in particular BGA-devices, within a reasonable time (not a big fan of 8-12 weeks). If they got them at all
